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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication:: From Particle Scale to Feature, Die and Wafer Scales

by Jianfeng Luo,David A. Dornfeld

ISBN 13: 9783642061158

Format: Paperback (336 pages)
Publisher: Springer Berlin Heidelberg
Published: 19 Feb 2010

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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales

by Jianfeng Luo,David Dornfeld

ISBN 13: 9783540223696

Format: Hardcover (311 pages)
Publisher: Springer
Published: 07 Oct 2004

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